TSMC plans to enter advanced memory chip manufacturing,布局3D DRAM at NVIDIA's request.

BlockBeats news, November 6, according to The Information, two sources said that TSMC (TSM.N) is considering expanding into advanced memory chip manufacturing, a move that would give the world's largest chipmaker a larger share of the AI hardware supply chain. TSMC (TSM.N) recently began making plans to produce a specific type of advanced memory chip—3D DRAM—in response to a request from its largest customer Nvidia (NVDA.O). DRAM, or dynamic random access memory, holds data while a processor uses it. Unlike traditional DRAM, which places memory cells in a single layer, 3D DRAM stacks cells vertically to hold more memory.

Memory chip manufacturing is currently dominated by Samsung Electronics, SK Hynix and Micron Technology. All three companies are also developing 3D DRAM technology, competing in next-generation memory manufacturing. A severe shortage of memory chips triggered by the AI hardware boom has sent prices soaring and prompted chip design companies such as Nvidia and Apple to look for additional sources of supply. Earlier this year, Apple raised prices for its devices due to rising memory costs.