Musk Comments on Memory Chip Stock Selloff: Once China Masters Manufacturing Technology, Its Capacity Expansion Often Exceeds the Rest of the World Combined

BlockBeats news, October 13 — In response to the sell-off in memory chip stocks, Musk posted that once China masters the manufacturing technology for a certain product, its ability to scale production often exceeds that of the rest of the world combined, as has already happened in the lithium battery and solar sectors.

He said the memory industry may be different, but about three years ago, memory was still a low-margin commodity. LP5 and LP6 follow common standards, and China appears to be rapidly mastering the relevant technology. However, the next-generation HBM architecture, as well as technologies such as placing an SRAM layer beneath logic circuits, stacking memory in three dimensions above, and simultaneously solving logic circuit heat dissipation, will be harder to overcome.

Musk also said that SpaceX is a rare counterexample, with the total mass of payloads it sends into orbit about an order of magnitude higher than the rest of the world combined. But excluding SpaceX, China already accounts for the majority of the total mass of payloads sent into orbit.

Previously reported, ChangXin Technology announced key progress in the research and development of the 4F² architecture for next-generation DRAM, and is expected to launch DDR5 RDIMM server memory products integrating this architecture, hybrid bonding, and other technologies by the end of the year. Compared with the mainstream 6F² architecture, 4F² can theoretically reduce cell area by about one-third and increase storage density by about 50% under the same wafer area and process node, raising market concerns about future competition and supply expansion.