Qualcomm and Amazon have reached a multi-generational partnership to jointly advance custom AI data center chips.

BlockBeats News, September 8 - Qualcomm (QCOM.O) announced today a multi-generational collaboration with Amazon (AMZN.O) to provide custom chips for large-scale AI data centers and jointly advance AI inference.

The two companies are also collaborating on developing optical interconnect solutions up to 1.6T and future generations. Qualcomm plans to deepen its use of AWS AI infrastructure (including Amazon Bedrock) for electronic design automation (EDA) workloads, aiming to shorten chip design cycles.

Qualcomm President and CEO Cristiano Amon stated that accelerating AI demand requires breakthroughs in both computing and connectivity for data center infrastructure, and Qualcomm is pleased to collaborate with AWS on custom chips and connectivity solutions. AWS Vice President Prasad Kalyanaraman noted that this collaboration builds on a strong partnership, with a shared commitment to delivering more efficient and cost-effective infrastructure to customers.