SK Hynix Plans to Deepen Cooperation with Japanese Memory Industry and Advance US HBM Packaging Base Construction

BlockBeats News, August 28th, SK hynix CEO Kwak Noh-Jung stated that the company is exploring deeper cooperation with Japanese storage chip customers and suppliers, and carefully evaluating how to jointly develop the NAND flash market. Regarding the company's significant indirect stake in Kioxia, he stated that there is currently "no firm plan."

After Toshiba reduced its holdings this month, the investment vehicle BCPE Pangea Cayman2, which holds relevant shares for SK hynix, has become Kioxia's largest shareholder, with a stake of 14.19%. SK hynix holds bonds that can be converted into almost all of the voting rights of this investment vehicle; under a previous agreement, unless Kioxia agrees, its voting rights cannot exceed 15% before 2028.

In addition, SK hynix is investing over $4 billion to build its first U.S. HBM packaging base in Indiana. The factory's clean room is expected to start operations in October 2028, with the next-generation HBM planned for mass production in the second half of 2029. Once fully operational, the facility is expected to employ around 1,000 people. The company is also still evaluating the possibility of listing its U.S. NAND subsidiary, Solidigm, but no decision has been made yet.