AMD and Samsung are nearing completion of a large-scale supply agreement for HBM4, with shipments expected to begin in late Q3, according to sources familiar with the matter.

BlockBeats News, July 24th, according to the Seoul Economic Daily, AMD CEO Lisa Su stated that the company's negotiations with Samsung Electronics for a large-scale supply contract for HBM4 are "close to completion." In March of this year, the two parties signed a memorandum of understanding, including Samsung's priority supply of HBM4 to AMD's new generation AI accelerator and advancement of wafer foundry cooperation.

Lisa Su stated at the "AMD Advancing AI 2026" event that the AI server rack system Helios has entered full-scale production and is expected to start shipping by the end of the third quarter. With the start of production of Helios, AMD is in discussions with Samsung to further expand the specific contract for HBM4 supply.

Samsung Electronics' Foundry Business Head Han Jin-man and Americas Semiconductor Business Head Cho Sang-yeon attended the event and continued discussions with AMD CTO Joseph Macri and other executives after the speeches. The two Samsung executives mentioned that an important meeting will be held soon but did not specifically address the follow-up contract regarding HBM4.

When asked about the future supply of HBM and the possibility of AMD's chips being manufactured by Samsung, Macri only mentioned that both parties maintain a "cooperative relationship."