Samsung Electro-Mechanics Expands Partnership with Qualcomm for FC-BGA Package Substrate Production, Extending Collaboration to Data Center Business

BlockBeats News, June 22, Samsung Electro-Mechanics has begun mass production of the packaging substrate for Qualcomm's first data center AI accelerator at its Busan factory. This supply marks the expansion of its cooperation with Qualcomm from the traditional mobile and PC fields to the data center market.

Samsung Electro-Mechanics recently started mass production of FC-BGA (Flip Chip Ball Grid Array) packaging substrates for Qualcomm's latest AI accelerator "AI200." The "AI200" is Qualcomm's first AI accelerator for data centers, which was released in October last year, mainly designed for AI inference scenarios. The chip features a self-developed "Oryon" CPU and "Hexagon" NPU, combined with low-power LPDDR5 memory to improve energy efficiency.

Qualcomm plans to launch the AI200 in the second half of this year, so Samsung Electro-Mechanics has also entered mass production of FC-BGA in advance to match the product launch schedule. This also indicates that the cooperation between the two parties in the AI chip supply chain is accelerating towards the data center infrastructure field.

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