Samsung Electronics has launched an advanced semiconductor packaging R&D facility in Yokohama, Japan.

BlockBeats News, September 8 - Samsung Electronics has launched an advanced semiconductor packaging R&D facility in Yokohama, Japan. Samsung previously announced plans to invest approximately 40 billion yen over five years starting in 2024 to expand the laboratory's research hardware and strengthen its advanced packaging technology capabilities. The advanced packaging lab will collaborate with local Japanese companies, universities, and research institutions to develop next-generation packaging materials and processes. Samsung aims to have over 100 researchers at the facility by 2027.