SK Hynix is incorporating advanced packaging technology for its next-generation HBM solution

BlockBeats News, August 24th, SK hynix is ​​introducing advanced packaging technologies for its next-generation HBM solution, including Intel's EMIB, and planning to eventually enter the 3D packaging era.

At the 2026 Hot Chips conference, Jaesik Lee, Vice President of Packaging Engineering at SK hynix, delivered a presentation titled "Advanced Packaging for High-Bandwidth Memory," detailing how the company will leverage advanced packaging technology to accelerate its HBM product roadmap. Currently, SK hynix is ​​exploring methods such as Hybrid Bonding to overcome the 16-layer stacking limit. In the future, SK hynix also plans to address power consumption challenges by increasing the number of TSVs, enhancing the IO speed of logic process integration, and optimizing the Power Delivery Network (PDN).

At the time of publication, SK hynix's Korean stock rose by 1.71%.