BlockBeats News, July 29th, SK Hynix financial report revealed that HBM4 mass production and shipment have been achieved in the second quarter, with plans to expand production and supply in the second half of the year; HBM4E samples have been delivered in the first half of the year, utilizing the optimal process technology. The company emphasized that it will continue to solidify its leading position in HBM based on high quality, high yield rate, stable supply, cost competitiveness, and maximum performance. At the same time, it has signed long-term chip supply agreements with 10 customers to enhance medium- to long-term demand visibility, address price fluctuations, and is evaluating additional shareholder return measures to enhance the scale and sustainability of returns. Capital expenditure for 2026 is expected to reach the high end of the 400 trillion Korean won range.
In the third quarter, DRAM shipment volume is expected to increase by about 10% on a quarter-on-quarter basis, while NAND shipment volume is expected to increase at a low single-digit rate. With the easing of supply constraints and the expansion of AI applications, the growth momentum of smartphones and PCs will gradually recover. However, due to memory supply challenges, related sales will be temporarily adjusted. The improvement of AI models and software efficiency will increase accessibility and drive infrastructure demand. The year-on-year DRAM market demand in 2026 is expected to be in the range of 20%-30% in the middle, and NAND year-on-year growth is expected to be at the high end of the 10%-20% range.
