TrendForce: TSMC Accelerates CoWoS Development, Glass-Based Interposers to Achieve Mass Production Post-2030

BlockBeats News, June 17th, TrendForce's latest report indicates that the rapid growth in demand for AI semiconductors is driving the advancement of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as the new industry battleground. TSMC is currently focusing on the CoWoS packaging architecture and has standardized the use of a 310 × 310 mm panel format.

It is expected that 2026 will be a critical validation period for relevant equipment and material suppliers, with a target for pilot production in 2027 and mass production in the second half of 2028. In addition to CoWoS, TSMC's next-phase focus is expected to shift to glass core substrates, with commercial-scale production likely to occur after 2030.