KUN Makes Appearance at Singapore Fintech Festival to Discuss Global Payment Industry Trends

BlockBeats News, November 6, 2024 - From November 6 to 8, 2024, Kun (KUN) will participate in the Singapore Fintech Festival, bringing together pioneers in the global financial industry and elite members of the payment industry to explore the infinite potential of the Web3 payment industry.

As a trusted global digital payment service provider, Kun (KUN) offers a one-stop Web2+Web3 payment service. Through its three major product lines - KUN | Exchange, PayX, and K-Card - Kun (KUN) provides global payment solutions for traditional B2B/bulk trade, international advertising, general entertainment, and Web3 projects. Through this grand event, Kun (KUN) will join hands with many industries to witness the arrival of a new payment era.

Location: Singapore Expo Convention and Exhibition Centre Hall 1-6. Booth Number: 4L19